Wednesday, April 25, 2012

NJMET Affiliates with Aeroflex RAD for Radiation Testing

I am happy to announce that NJMET is now affiliating with Aeroflex RAD in Colorado Springs, CO to test the effects of radiation on electronic components.  This affiliation will enable NJMET, based in Clifton NJ, to add radiation testing to NJMET’s electrical functional and parametric testing of components. 

The process will now be seamless for clients. They will send their components to NJMET for testing and NJMET will perform initial electrical functional and parametric testing at the devices ambitent and maximum operating temperature ranges before sending the components to Aeroflex RAD for radiation effect testing as part of a comprehensive suite of tests.  The components will be returned to NJMET for additional round of the same electrical testing after the radiation exposure.

Aeroflex RAD is the only facility in the country to be DSCC certified for radiation testing to both MIL-STD-750 and MIL-STD-883.  I am proud that NJMET is affiliating with Aeroflex RAD to provide this reliability service.

For more information, see our press release:
NJ MET Announces Affiliation with Aeroflex RAD to Provide Radiation Testing and Support

Friday, March 23, 2012

DNA Marking Technologies

DNA testing is so commonplace on TV, if not in real life, that we are used to the idea that DNA testing can be used to unequivocally identify a person from the tiniest bit of genetic material. In today’s world it is only a small leap forward to suggest that we could identify manufactured parts using DNA marking.

Two DNA marking technologies are emerging for electronic components. One pioneered by the College of Nanoscale Science and Engineering (CNSE) of the University at Albany and Long Island-based Applied DNA Sciences, Inc, involves injecting plant DNA into electronic components during manufacturing. The other approach relies on the unique properties found in the silicon used in the chips. This approach is known as Hardware Intrinsic Security (HIS) and revolves around Physically Unclonable Function (PUF) technology, It is being developed by members of the HIS consortium including Intrinsic-ID BV, Cisco Systems, TSMC, NXP, Microsemi, IMEC, MIPS, SiVenture and Renesas.

DNA testing of electronic components is likely to become an exciting new tool to combat counterfeit electronic components. It makes a nice fit with existing testing methods for counterfeit components.

For more information about both approaches to DNA marking of electronic components see: