DNA testing is so commonplace on TV, if not in real life, that we are used to the idea that DNA testing can be used to unequivocally identify a person from the tiniest bit of genetic material. In today’s world it is only a small leap forward to suggest that we could identify manufactured parts using DNA marking.
Two DNA marking technologies are emerging for electronic components. One pioneered by the College of Nanoscale Science and Engineering (CNSE) of the University at Albany and Long Island-based Applied DNA Sciences, Inc, involves injecting plant DNA into electronic components during manufacturing. The other approach relies on the unique properties found in the silicon used in the chips. This approach is known as Hardware Intrinsic Security (HIS) and revolves around Physically Unclonable Function (PUF) technology, It is being developed by members of the HIS consortium including Intrinsic-ID BV, Cisco Systems, TSMC, NXP, Microsemi, IMEC, MIPS, SiVenture and Renesas.
DNA testing of electronic components is likely to become an exciting new tool to combat counterfeit electronic components. It makes a nice fit with existing testing methods for counterfeit components.
For more information
about both approaches to DNA marking of electronic components see: http://www.ttiinc.com/object/me-slovick-20120222.html.